HT® 424
HT® 424 is an aluminum filled modified epoxy phenolic resin coated on a glass carrier. It was developed for bonding metal-to-metal and sandwich composite structures requiring long-term exposure to 300˚°F (149˚°C) and short-term exposure to 500°˚F (260˚°C). HT® 424 has an adaptable bonding procedure with cure temperatures ranging from 12 hours at 230°˚F (110°˚C) to 40 minutes at 340°˚F (171°˚C) that can be used without sacrificing physical properties.
HT® 424 adhesive film may be used with or without a primer. The film-primer system offers the advantage of protecting the clean metal prior to final assembly.
Features and Benefits
- Used in metal-to-metal bonding and sandwich composite structures
- Long-term exposure to 300°˚F (149°˚C); short-term exposure to 500°˚F (260˚°C)
- Can be used with or without primer
- Wide variations in bonding temperatures: 12 hours at 230°˚F (110˚°C) to 40 minutes at 340°˚F (171˚°C)
Markets
| Segments | Applications |
|---|
Processing Method
- Autoclave
- Compression Molding
Chemical categories
| Chemical category | Chemical family | Chemical product |
|---|---|---|
| Composite materials | Adhesives & surfacing | Epoxy/Phenolic |
Product Functions
- High Service Temperature (>150°C)
Format
| Physical form |
|---|
Adhesives |
Region of availability
- Africa & Middle East
- Asia Pacific
- Europe
- Latin America
- North America