Skip to main content

CYCOM® 5320-1

Product functions: High Service Temperature (>150°C)
CYCOM® 5320-1 is a toughened epoxy resin prepreg system designed for out-of-autoclave manufacturing of primary structural applications. Because of its lower temperature curing capability, it is also suitable for prototyping where low cost tooling or vacuum-bag-only curing is required. CYCOM® 5320-1 handles like standard prepreg, yet can be vacuum bag cured to produce autoclave quality parts having very low porosity. It offers mechanical properties equivalent to other 350°F (177°C) autoclave-cured toughened epoxy prepreg systems after a 350°F (177°C) freestanding postcure.Type: thermoset composite | Temp: service temp < 320F | Process: autoclave, out of autoclave | CAI KSI: medium | OHC Wet: high | TG Wet: 310 (154) | Proc Temp: 200 (93) or 250 (121) cure, 350 (177) post-cure


Segments Applications End uses
Propulsion Nacelles Fan Cowls
Defense Next-generation aircraft
Defense UAVs / Drones
Space Launch Vehicles Cryogenic tanks

Processing Method

  • Autoclave
  • Vacuum Bag Only
  • Compression Molding

Chemical categories

Chemical category Chemical family Chemical product
Composite materials Thermoset composite Epoxy

Product Functions

  • High Service Temperature (>150°C)


Physical form
Structural Prepregs

Region of availability

  • Africa & Middle East
  • Asia Pacific
  • Europe
  • Latin America
  • North America

Download documents for CYCOM® 5320-1

Recently viewed products