CYCOM® 5320-1

CYCOM^® 5320-1 is a toughened epoxy resin prepreg system designed for out-of-autoclave manufacturing of primary structural applications. Because of its lower temperature curing capability, it is also suitable for prototyping where low cost tooling or vacuum-bag-only curing is required. CYCOM^® 5320-1 handles like standard  prepreg, yet can be vacuum bag cured to produce autoclave quality parts having very low porosity. It offers mechanical properties equivalent to other 350°F (177°C) autoclave-cured toughened epoxy prepreg systems after a 350°F (177°C) post-cure. The laminate can support a freestanding post-cure after an initial low temperature cure. The material can also be cured under positive pressure in an autoclave or press.
Features and Benefits

• Flexible cure cycles including vacuum bag only, autoclave and press molding
• Very low void content for vacuum bag only cure
• No autoclave required for cure, but autoclave cure options include low pressure autoclave cure and autoclave cure cycles compatible with other CYCOM and adhesive products
• Excellent hot/wet and notched properties
• Mechanical properties equivalent to those of autoclave-cured toughened epoxy systems
• Long tack and shop life at room temperature
• Available in woven fabric and unidirectional tape formats including materials for AFP and ATL
• Optimized processing characteristics for both monolithic laminate and honeycomb sandwich parts
• Suitable for producing complex parts
• Low temperature cure capability
• Databases available

Availability

Syensqo can customize the prepreg with various resin content and reinforcement combinations including film, mat or veil products. These products are commercially available items. Please submit an inquiry or request a quotation using the links provided.