FM® 57 film adhesive is a condensation polyimide adhesive supplied as a supported film with woven fiberglass carrier. FM® 57 does not contain methylene dianiline (MDA). It is suitable for bonding metallic and non-metallic substrates as well as honeycomb structures.FM® 57 film adhesive can be processed at 350°F (177°C) with a free-standing post-cure at 550°F (288°C). This adhesive film provides a service temperature of -67 to 550°F (-55 to 288°C) and can be used for repair and radar applications.
Features and Benefits
- Condensation polyimide
- 550°F (288°C) service temperature
- 350°F (177°C) processing
- Does not contain MDA
- Suitable for honeycomb structure bonding
Availability
Syensqo can customize the adhesive with various resin weight and carrier combinations. These products are commercially available items. Please submit an inquiry or request a quotation using the links provided.
Markets
| Segments | Applications |
|---|---|
| Defense | Next-generation aircraft |
| Propulsion | Engines |
| Propulsion | Nacelles |
Processing Method
- Autoclave
- Compression Molding
Chemical categories
| Chemical category | Chemical family | Chemical product |
|---|---|---|
| Composite materials | Thermoset composite | Polyimide |
Product Functions
- High Service Temperature (>150°C)
Format
| Physical form |
|---|
Adhesives |
Region of availability
- Africa & Middle East
- Asia Pacific
- Europe
- Latin America
- North America