FM®309-1

FM®309-1

FM®309-1 is a next generation film adhesive for bonding composite and metallic structures. This new film provides a unique combination of high Tg [360°F (182°C)], high toughness and higher temperature properties. FM®309-1 is compatible with most 350°F (177°C) curing epoxy-based prepreg systems. This new film has excellent resistance to pre-bond and post-bond humidity and has a service temperature of 350°F (177°C).
FM®309-1 adhesive film provides excellent handling properties (good tack and drape) and has a minimum shop life of 30 days at 75°F (24°C).
FM®309-1 adhesive can be supplied as a supported (woven glass, knit or mat carrier) or unsupported film at various weights and thicknesses. For co-cure or co-bond applications, adhesive film weight of 0.030 – 0.050 psf (146 gsm – 244 gsm) with mat carrier is recommended. This adhesive film is suitable for bonding of monolithic or sandwich structures. Honeycomb sandwich panels manufactured using FM®309-1 adhesive film demonstrate excellent laminate quality - void content < 1>

FM®309-1 adhesive film can be cured at 350°F (177°C) in 90 minutes at 40 psi (0.28 MPa) or can also be cured under vacuum-only pressure. The performance after vacuum cure is comparable to that after pressure cure.
Typical application for FM®309-1 include bonding of composite and metallic structures, as well as co-cure, co-bond, and secondary bonding applications

• · 350°F(177°C) curing high performance composite bonding film
• · Compatible with most 350°F(177°C) curing epoxy prepregs
• · Excellent fracture toughness (co-cure, co-bond or secondary bond)
• · Service temperature of 350°F(177°C) dry and 285°F(141°C) wet
• · Excellent resistance to both pre-bond and post-bond humidity
• · Good combination of high peel and shear properties Tg >; 356°F (180°C)
• · Suitable for bonding composite sandwich structures (good filleting properties)
• · Good tack and handling properties· 
•   Shop life >;30 days at 75°F (24°C)
• · Storage life of 12 months from date of shipment when stored at or below 0°F(-18°C)