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FM®309-1

Product functions: High Service Temperature (>150°C)

FM®309-1 is a next generation film adhesive for bonding composite and metallic structures. This new film provides a unique combination of high Tg [360°F (182°C)], high toughness and higher temperature properties. FM®309-1 is compatible with most 350°F (177°C) curing epoxy-based prepreg systems. This film adhesive has excellent resistance to pre-bond and post-bond humidity and has a service temperature of 350°F (177°C).

FM®309-1 adhesive film provides excellent handling properties (good tack and drape) and has a minimum shop life of 30 days at 75°F (24°C). This adhesive film is suitable for bonding of monolithic or sandwich structures.  Honeycomb sandwich panels manufactured using FM® 309-1 adhesive film demonstrate excellent laminate quality (void content <1%) and very good filleting. 

FM®309-1 adhesive film can be cured at 350°F (177°C) in 90 minutes at 40 psi (0.28 MPa) or can also be cured under vacuum-only pressure. The performance after vacuum cure is comparable to that after pressure cure.
Typical application for FM®309-1 include bonding of composite and metallic structures, as well as co-cure, co-bond, and secondary bonding applications

 
Features and Benefits
  • 350°F(177°C) curing high performance composite bonding film
  • Compatible with most 350°F(177°C) curing epoxy prepregs
  • Excellent fracture toughness (co-cure, co-bond or secondary bond)
  • Service temperature of 350°F(177°C) dry and 285°F(141°C) wet
  • Excellent resistance to both pre-bond and post-bond humidity
  • Good combination of high peel and shear properties Tg >; 356°F (180°C)
  • Suitable for bonding composite sandwich structures (good filleting properties)
  • Good tack and handling properties
  • Shop life >;30 days at 75°F (24°C)
  • Storage life of 12 months from date of shipment when stored at or below 0°F(-18°C)

Availability

FM®309-1 adhesive can be supplied as a supported (woven glass, knit or mat carrier) or unsupported film at various weights and thicknesses. For co-cure or co-bond applications, adhesive film weight of 0.030 – 0.050 psf (146 gsm – 244 gsm) with mat carrier is recommended. Syensqo can customize the adhesive with various resin weight and carrier combinations. These products are commercially available items. Please submit an inquiry or request a quotation using the links provided.

 

Markets

SegmentsApplicationsEnd uses
Advanced Air MobilityAir Taxis / Heavy Goods CargosStructures
Advanced Air MobilityLarge Cargo DronesStructures
Fixed Wing AircraftStructuresWings and Empennages
DefenseNext-generation aircraft
PropulsionEngines
Rotocraft

Processing Method

  • Autoclave
  • Vacuum Bag Only
  • Compression Molding

Chemical categories

Chemical categoryChemical familyChemical product
Composite materialsThermoset compositeEpoxy

Product Functions

  • High Service Temperature (>150°C)

Format

Physical form
Adhesives

Region of availability

  • Africa & Middle East
  • Asia Pacific
  • Europe
  • Latin America
  • North America

Download documents for FM®309-1

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