FusePly® 250

FusePly^® 250 is a new game-changing material technology designed to achieve covalent chemical bonding in adhesive joints of pre-cured composite structures using either conventional co-bonding or secondary bonding processes.

Through patented technology, FusePly^® 250 is able to bring a new level of reliability to the typical 250°F bonding process by creating a chemically-active surface for bonding, rather than just a mechanically-prepared surface as with traditional peel plies, sanding, or plasma surface treatment. The result is structural performance and dependability of co-cured bonded structures with the convenience and flexibility from using pre-cured composites.

FusePly^® 250 was designed to be processed and handled just like conventional peel ply surface preparations, allowing for seamless insertion of the technology into a manufacturing shop. The system, supplied in film form with a peel ply fabric, is engineered to offer a clean, fiber-free surface for composite bonding applications.

FusePly^® 250 is compatible with most commercial epoxy-based prepregs and adhesive systems. FusePly^® 250 requires no additional processing steps, such as sanding or solvent wiping prior to bonding.

Features and Benefits

• Chemically-bonded interface creates unitized structures
• Handling and processing is similar to conventional peel ply films
• Compatible with most epoxy-based commercial prepregs and 250°F curing adhesives
• Minimizes the number of processing steps and reduces assembly time
• Contamination-free surface, with no residual fibers, provides ideal surface for bonding
• Superior reliability and bond performance for composite structures versus conventional surface treatment options
• Outperforms traditional surface preparation methods including plasma surface treatment
• Provides 100% cohesive failure
• Easy removal of peel ply fabric following cure
• Suitable for co-bonding and secondary bonding of composite parts