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Semiconductors

Enabling the AI era: semiconductors at the core of the connected world

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The rise of AI-driven demand

As artificial intelligence reshapes industries, economies, and daily life, semiconductors are once again stepping into the spotlight. These tiny but mighty components are now tasked with powering AI workloads across data centers, personal devices, and next-generation applications. Behind every AI engine, from generative models to real-time analytics, are specialized chips built for speed, efficiency, and complexity.

While the world is more connected than ever, with approximately 25 billion devices already online and projections of around 38 billion IoT connections by 2030*, it is the AI-enabled world that is now defining the next frontier of innovation. And with it comes a new set of technical demands: more powerful chips, more extreme manufacturing environments, and more stringent purity requirements.

At Syensqo, we are proud to play a crucial role in enabling this transformation. Our best-in-class materials and deep industry knowledge support the production of the most advanced semiconductors on the planet, those essential to the AI era.


AI chips: driving the next wave of semiconductor innovation

The explosive growth of artificial intelligence is impacting the entire semiconductor value chain. AI chips demand unprecedented performance levels, pushing manufacturers to operate at new extremes, from angstrom-scale features to plasma treatments and ultra-high or ultra-low temperature conditions.

These new processing environments require exceptional material performance: high purity, superior thermal and chemical resistance, and high-performance consistency under aggressive plasma exposure. Every step in manufacturing AI chips becomes more complex, and every material in the process must meet tighter tolerances.

At Syensqo, we are uniquely positioned to meet these evolving needs. From wafer fabrication to advanced packaging, our materials support efficiency, reliability, and innovation across the entire semiconductor process.

Christine McGuiness

AI is pushing the boundaries of traditional semiconductor chip manufacturing processes. Our materials are designed to perform in the most demanding environments, enabling the performance leap that AI applications require.

Christine McGuiness, Head of Marketing - Electronics & Industrial Semiconductors

Leading with performance: the rise of Tecnoflon® FFKM NFS

One of the clearest examples of our market-first innovation is Tecnoflon®FFKM NFS, a new line of non-fluorosurfactant perfluoroelastomers (FFKMs) designed specifically for semiconductor manufacturing applications and other highly demanding markets.

Syensqo is first to market with this proprietary non-fluorosurfactant (NFS) technology, eliminating the use of fluorosurfactants from the manufacturing process. And, we are launching a full suite of materials, each grade optimized for specific performance conditions. Whether it’s resistance to aggressive plasma conditions, stability at extreme high or cryogenic temperatures, or enhanced contamination-free sealing under harsh chemical exposure, Tecnoflon® FFKM NFS is setting new standards.

“The real breakthrough here isn’t just sustainability - it’s performance,” adds Christine. “We’re offering a brand-new portfolio engineered for the most advanced chipmaking processes. And yes, we’re producing it in a more sustainable way, but performance is what earns customer adoption,” says Christine.

By removing fluorosurfactants from the manufacturing process, we also reduce environmental impact, providing a dual benefit of next-generation performance and progress toward sustainable production goals.


Purity matters: advancing Solef® PVDF for the chips of tomorrow

In the AI era, purity is paramount. Syensqo’s high-purity Solef® PVDF plays a crucial role in enabling semiconductor manufacturers to reach the quality thresholds required by next-gen fabs. As chip architectures become more sensitive, the demand for ultrapure materials, especially for water and fluid management, increases.

Syensqo is actively working to elevate purity levels even further, helping fabs future-proof their operations and prepare for the demanding process requirements of AI chip production. These ongoing innovations will ensure that Solef® remains at the forefront of semiconductor performance.


Supporting a smarter, more sustainable semiconductor industry


While performance is paramount, sustainability remains a defining priority for the semiconductor sector. As fabs strive to meet Scope 1, 2, and 3 emissions targets, they rely on partners like Syensqo for solutions that minimize environmental impact without compromising technical requirements.

Through our Syensqo One Planet roadmap, we are transforming our materials and processes, incorporating circular and bio-based feedstocks, developing low-global warming potential molecules, and innovating polymerization techniques to reduce energy use.

This commitment to environmental responsibility extends to conversations with semiconductor equipment manufacturers and fabs on end-of-life strategies and circular materials, exploring new ways to recover, reuse, and reintroduce high-performance materials with virgin-equivalent quality.

Syensqo One Planet Goals

 

A global partner, regionally rooted

Semiconductors have become a matter of strategic importance for regions around the world. As countries invest in local production capabilities, whether through the CHIPS Act in the U.S. or similar initiatives in Europe and Asia, supply chain resilience is paramount.

Syensqo is proud to support this evolution with a globally integrated yet locally present model. We serve premier fabs across all major regions, ensuring customers have access to the right materials, technical support, and production capacity wherever they operate.


Materials for the AI era

From data centers powering generative AI to edge devices enabling smart automation, the future runs on AI, and AI runs on chips. Those chips, in turn, depend on the advanced materials that make their creation possible.

We are building the material foundation for this next generation of semiconductor innovation. By combining performance leadership, sustainable design, and a truly global footprint, we help the world’s leading fabs bring the future of technology to life.

*Data Sources: https://www.gsmaintelligence.com/research/iot-connections-forecast-to-2030 and https://www.gsmaintelligence.com/research/iot-connections-forecast-the-rise-of-enterprise