FM®50 is a MDA-free polyimide foam intended for core-splicing applications.
Features and Benefits
- Service temperatures of 500°F to 600°F (260°C to 315°C)
- No metallic fillers
- Free or restrained foaming process
- Cure cycle: 60 minute ramp to 350°F (177°C), 90 minute hold at 350°F, then post cure 2 hours at 550°F (288°C)
- Expansion Ratio: 2X
Availability
Syensqo can customize the adhesive with various resin weight and carrier combinations. These products are commercially available items. Please submit an inquiry or request a quotation using the links provided.
Markets
| Segments | Applications |
|---|---|
| Propulsion | Engines |
| Defense |
Processing Method
- Autoclave
Chemical categories
| Chemical category | Chemical family | Chemical product |
|---|---|---|
| Composite materials | Thermoset composite | Polyimide |
Product Functions
- High Service Temperature (>150°C)
Format
| Physical form |
|---|
Adhesives |
Region of availability
- Africa & Middle East
- Asia Pacific
- Europe
- Latin America
- North America