METLBOND® 1146

METLBOND® 1146
METLBOND® 1146 is a 250°F (121°C) to 350°F (177°C) curing modified epoxy film adhesive.

Features and Benefits:

• Maximum continuous use temperature of 250°F (121°C) dry and 225°F (107°C) wet
• High shear strength and strain properties
• Excellent toughness
• Outstanding environmental durability
• Excellent adhesion to metal and composite substrates
• Flexible cure conditions

Applications include composite to composite bonding, composite to metal bonding, metal to metal bonding, and honeycomb sandwich bonding.