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BR® 127 NC corrosion inhibiting primer is the non-chromated version of our standard BR® 127 corrosion inhibiting primer.BR® 127 NC can be used with essentially

BR® 252 corrosion inhibiting primer is a non-chromated, one-part, modified epoxy bonding primer designed to meet stringent requirements of adhesive bonding prim

BR® 623P4 is a one-part epoxy material designed for use in insert or edge filing of honeycomb structures.

BR® 4535A is a single component, 100% solids, aluminum filled, 250 – 300 °F (120 – 150°C) curing epoxy paste adhesive. It has been develop

Type: potting compound | Temp: service temp < 320F | Process: autoclave | Proc Temp: 250 (121) | Serv Temp: 284 - 347 (140 - 175) | Density: - | RT Comp: -

CORFIL® 5250-4 is a single component, non-metallic filled, syntactic material formulated for use in insert potting, edge filling, and core

Rubber modified self-adhesive phenolic prepreg for interior aircraft applications.Type: Phenolic | Temp: Cure temperature 255-275 | Process: Oven Cure | OSU Hea

CYCOM® 114 is a unidirectional glass reinforced epoxy prepreg which cures at 325°F (163°C) and has a 250°F (121°C) service temperature. Applications for CYCOM®

Rubber-modified, self-adhesive phenolic prepreg for interior aircraft applications. Sandwich panel press grade for multiple opening press.

Very tough modified epoxy resin system with exceptional high temperature performance. Suitable for highly stressed components exposed to elevated temperature en

CYCOM® 5216 is a 200°F to 250°F (93°C to 121°C) curing modified epoxy resin with a service temperature range of -67°F to 180°F (-55°C to 82°C).

Epoxy resin systemType: thermoset composite | Temp: service temp < 320F | Process: autoclave | CAI KSI: low | OHC Wet: medium | TG Wet: 234 (112) | Proc Temp

CYCOM® 6070 is a 280°F to 320°F (138°C to 160°C) curing phenolic resin. It has a service temperature up to 500°F (260°C) when step-wise post cured at 450°F (232

Epoxy resin systemType: thermoset composite | Temp: service temp &lt; 320F | Process: autoclave | CAI KSI: low | OHC Wet: low | TG Wet: 320 (160) | Proc Temp: 3

Epoxy resin systemType: thermoset composite | Temp: service temp < 320F | Process: autoclave | CAI KSI: low | OHC Wet: low | TG Wet: 320 (160) | Proc Temp: 3

Type: thermoset composite | Temp: service temp < 320F | Process: autoclave | CAI KSI: medium | OHC Wet: medium | TG Wet: 246 (119) | Proc Temp: 250 (121)

Versatile curing toughened epoxy resin, can be cured from 135°C to 177°C. Following a 177°C cure, 977-6 has a 138°C dry and a 104°C wet service temperature. Rec

Controlled flow, 350°F (177°C) curing toughened epoxy resin with 350°F (177°C) dry and 270°F (132°C) wet service temperature capability. Formulated for ease of

FM® 355 is a 350°F (177°C) curing epoxy adhesive formulated to maximize toughness in applications requiring hot/wet performance up to 350°

FM® 350NA FM® 350NA is a 340°F to 365°F (171°C to 185°C) curing, epoxy adhesive. FM® 350NA adhesive film is a non-asbestos aluminium-filled str