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Epoxy-based co-curable surfacing film for composites cured at 250°F (121°C) or 350°F (177°C). The product is supplied on a non-woven fabric carrier at nominal w

120°C (248°F), versatile curing epoxy resin prepreg matrix designed for railway applications to offer fire protection on railway vehicles to meet Category HL2 o

CYCOM® PR 520N RTM is a one-part, 179°C (355°F) curing epoxy resin system offering superior damage tolerance and good strain to failure required for composite p

Epoxy resin systemType: thermoset composite | Temp: service temp < 320F | Process: autoclave | CAI KSI: low | OHC Wet: low | TG Wet: 240 (113) | Proc Temp: 2

Variable temperature, vacuum processable flame-retarded epoxy system. Typical cure between (65°C/149°F) and (180°C/356°F). Out life at (21°C/70°F) up to 21 days

L-528 is a modified phenolic prepreg with excellent fire, smoke, and toxicity properties.

MX® 2625 is a nominal 19 ounce per square yard silica fabric impregnated with a MIL-R-9299, Type II phenolic resin containing silica filler. MX® 2625 is availab

MX 2600 is a nominal 19 ounce per square yard silica fabric impregnated with a MIL-R-9299, Type II phenolic resin containing silica filler. MX 2600 is available

L-803 is a unique facesheet material consisting of cross-plied carbon prepreg with a fiberglass surface impregnated with flame retardant phenolic resin.Type: Ph

MX 4926N PREPREG MX 4926N is a rayon based, five-harness satin weave carbon fabric impregnated with a modified phenolic resin. The

MX 2646 is a nominal 640gsm silica fabric impregnated with a toughened, modified phenolic resin. MX 2646 is available as a chopped molding compound in 1/2 inch

This collector exhibits selectivity against pyrrhotite while maintaining nickel recovery. It can be used on its own or in conjunction with xanthate, in which ca

This product is a highly versatile collector that is most often used as a secondary collector in bulk copper-nickel flotation or for selective copper flotation

FM® 680 is an aluminum filled, condensation-type polyimide supported on a fiberglass cloth. It is suitable for bonding titanium, stainless steel and cured polyi

BR® 624 potting compound is a one-part, low density material formulated for use in insert or edge filling of honeycomb sandwich construction.

FM® 300 is a 350⁰F (177⁰C) curing modified epoxy film adhesive available with three different moisture-resistant polyester

Ideally suited to aerospace applications CYCOM® 97714A resin is a 250°F (121°C) curing epoxy resin with good 200°F (93°C) dry and 160°F (71°C) wet service capab

Epoxy resin systemType: thermoset composite | Temp: service temp < 320F | Process: autoclave | CAI KSI: medium | OHC Wet: low | TG Wet: 190 (88) | Proc Temp:

CYCOM® 737 EPOXY PREPREG CYCOM® 737 is a modified epoxy resin system developed for applications where high quality surface finish and UV stability are important

Epoxy resin systemType: thermoset composite | Temp: service temp < 320F | Process: autoclave | CAI KSI: low | OHC Wet: low | TG Wet: 190 (88) | Proc Temp: 25