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Epoxy resin systemType: thermoset composite, core splice foam | Temp: service temp < 320F> 500F | Process: autoclave | CAI KSI: low | OHC Wet: high | TG Wet: 34

Epoxy resin systemType: thermoset composite | Temp: service temp < 320F | Process: autoclave | CAI KSI: medium | OHC Wet: medium | TG Wet: 275 (135)

Toughened epoxy resin systemType: thermoset composite | Temp: service temp < 320F | Process: autoclave | CAI KSI: high | OHC Wet: medium | TG Wet: 284 (140)

Type: Surfacing Film | Out Time (days): 21 days out life | Process: Autoclave, Vacuum

Variable temperature,vacuum processable flame-retarded epoxy surface ply. Typical cure between 65°C/149°F and 180°C/356°F.Type: surfacing film | Out Time (days)

Variable temperature epoxy film adhesive suitable for bonding both composite and aluminium substrates or to honeycomb and foam core materials.

Variable temperature, vacuum processable epoxy system. Typical cure between (65°C/149°F) and (120°C/248°F). Out life at (21°C/70°F) 30 days. Maximum dry Tg (120

Variable temperature, vacuum processable flame-retarded epoxy system. Typical cure between (65°C/149°F) and (180°C/356°F). Out life at (21°C/70°F) up to 21 days

MTM46 is a high performance, 135°C (275°F) curing, toughened epoxy resin formulated for the production of aircraft structures (FAR23 aircraft and unmanned air v

Variable temperature, vacuum processable flame retarded epoxy system. Typical cure between (65°C/149°F) and (120°C/248°F). Out life at (21°C/70°F) up to 30 days

HTM® 131 is a clear cyanate ester resin formulated to provide excellent surface finish with a high level of mechanical performance retention at elevated tempera

MTM® 83 is a 125 to 135°C (257 to 275°F) curing phenolic resin matrix that exhibits excellent fire, smoke and toxicity performance to FAR25.853 and has good mec

MTM® 49L is a toughened epoxy resin developed for the manufacture of components. MTM® 49L prepregs exhibit excellent hot and wet performance combined with good

MTM® 49-1L is an 80 to 160°C (176 to 320°F) curing, toughened epoxy matrix resin developed for component manufacture.MTM49-1L prepregs exhibit excellent ambient

Toughened epoxy resin systemType: thermoset composite | Temp: service temp < 320F | Process: autoclave | CAI KSI: high | OHC Wet: medium | TG Wet: 302 (150)

Phenolic system available as a drapeable prepreg for fabrication of complex vacuum bag or autoclave cured parts or as a low tack prepreg for press cured parts.T

Extremely tough medium temperature curing modified epoxy resin. To use where impact resistance and lightweight as well as versatile cure conditions are required

CYCOM® 5250-4 RTM is a true one-part homogeneous BMI resin developed specifically for the resin transfer molding (RTM) process.

AeroPaste® 1006 is a two-part, low-temperature-curing paste adhesive designed for out-of-autoclave structural bonding and rapid assembly applications.

METLBOND® 2555 is a 350°F (177°C) cure modified cyanate ester film adhesive. This adhesive has good high temperature properties with low dielectric constant and