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MTM® 49-3 is an 80 to 160°C (176 to 320°F) curing, toughened epoxy matrix developed for component manufacture.

Medium temperature, multi-purpose epoxy system. Typical cure (120°C/248°F) for 1 hour. Out life at (21°C/70°F) 30 days. Dry Tg (125°C/260°F) | Commercial produc

Medium temperature, toughened epoxy system. Typical cure (120°C/248°F) for 1 hour. Out life at (21°C/70°F) up to 30days. Maximum dry Tg (100°C/212°F). High dama

Medium temperature, toughened epoxy system. Typical cure (120°C/248°F) for 1 hour. Out life at (21°C/70°F) up to 30days. Service up to (80°C/176°F).

USA Only | Medium temperature, toughened epoxy system. Typical cure (120°C/248°F) for 1 hour. Out life at (21°C/70°F) up to 30days.Service up to (80°C/176°F).

Medium temperature, toughened epoxy system. Typical cure (120°C/248°F) for 1 hour. Out life at (21°C/70°F) up to 90days.Service up to (80°C/176°F). | High damag

Medium temperature, flame-retarded epoxy system. Typical cure (125°C/257°F) for 1 hour. Out life at (21°C/70°F) 30 days. Dry Tg (100°C/212°F), wet Tg (85°C/185°

Medium temperature, highly toughened epoxy system. Typical initial cure (120°C/248°F) for 1 hour. Out life at (21°C/70°F) 30 days. Dry Tg (110°C/230°F). | High

High temperature resistant, inherently flame-retardant with low toxic gas and smoke generation, cyanate ester prepreg. Initial cure at 135°C (275°F). After a su

Medium temperature structural epoxy film adhesive suitable for bonding both aluminium and composite substrates or to honeycomb core materials.

Metlbond 1515-4 is a 350°F (177°C) curing modified epoxy supported film adhesives. Metlbond 1515-4 can also be cured at 250°F (121°C). Its maximum continuous se

Medium temperature, toughened epoxy system. Typical cure (120°C/248°F) for 1 hour. Out life at (21°C/70°F) 60days. Maximum dry Tg (140°C/284°F), Snap cures up t

Toughened epoxy optimized for damage tolerance.Type: thermoset composite | Temp: service temp < 320F | Process: out of autoclave | CAI KSI: medium

Low temperature cyanate ester system. Initial cure (70°C/158°F) for 20 hours. Out life at (21°C/70°F) 3 days. Max dry Tg after post-cure (330°C/626°F) | Good di

Low temperature, autoclave cure, epoxy tooling system. Minimum cure temperature (55°C/131°F). Out life at (21°C/70°F) 8 days. Maximum Tg after post-cure (210°C/

High-performance bismaleimide (BMI) resin/carbon fiber tooling system that is capable of continuous service at 375°F (190°C) and short cycle service at 400°F (2

350°F(177°C) cure toughened epoxy film adhesiveType: film | Temp: service temp < 320F, 320F 500F | Process: autoclave | Proc Temp: 350 (177) | RT Lap: 3500 (

A modified epoxy adhesive foam containing no metallic fillers designed for honeycomb splicing under ambient pressureType: core splice foam | Temp: service temp

FM® 94 adhesive is a 220°F (104°C) service temperature, modified epoxy film adhesive designed for bonding metallic and composite structures. FM® 94 adhesive off

High performance foaming agent for oilfield applciations. Please contact your local representative for more details.