Material innovations that help reduce emissions without redesign
The smart devices we rely on every day—from smartphones and tablets to wearables—are marvels of innovation. But behind every sleek surface is a growing environmental cost. With over 1.2 billion smartphones sold in 2024 and e-waste expected to reach 82 million metric tons by 2030, the electronics industry is under intense pressure to act.
As consumers demand more sustainable devices, OEMs are setting bold targets to decarbonize product lifecycles, from sourcing to end-of-life. Leading smartphone OEMs are now prioritizing low-carbon materials, traceability and sustainable design in their procurement decisions. Our Kalix® HPPA 2000 series is strategically developed to close this gap—delivering high mechanical performance and measurable sustainability gains.
Advancing low-carbon design from the inside out with Kalix® HPPA
At Syensqo, we’re proud to support this transformation with Kalix® 2545 and Kalix® 2555—two grades in our Kalix® 2000 Series of high-performance polyamides designed to reduce the environmental footprint of internal smart device components.
These materials are engineered for applications such as internal brackets that hold critical parts in place—where mechanical integrity, dimensional stability and digital signal protection are non-negotiable. Kalix® 2545 and 2555 deliver all of these benefits—while cutting carbon by more than 30% versus legacy Kalix® HPPA grades.
What makes Kalix® 2545 / 2555 different?
Both grades use a non-food-competing bio-based feedstock, castor oil, which enables a significantly lower PCF (product carbon footprint) compared to legacy grades—without compromising performance or requiring processing changes.
Key Benefits
- >30% lower carbon footprint vs. a non-sustainable PPA
- 30% improved ductility, allowing for thinner or more resilient parts
- >15% better dielectric properties, helping maintain digital signal integrity
- Drop-in compatibility, with no tooling or design changes required
These properties make Kalix® 2545 and 2555 ideal for structural components that demand strength and insulation—such as internal housings, midframes or acoustic chambers that must endure thermal cycling and mechanical stress in compact form factors.
Sustainable innovation, ready to scale
Kalix® HPPA is already trusted by Tier 1 suppliers and is used in smartphones and tablets around the world. Our newest grades extend that legacy by offering a more sustainable alternative—without asking engineers to sacrifice mechanical, thermal or processing performance.
From reduced GHG emissions to enhanced electrical performance, Kalix® 2545 / 2555 are built to support OEMs pursuing Scope 3 emissions reduction targets and more sustainable value chains.
These smart device material solutions are part of Syensqo’s broader ECHO portfolio— a selection of sustainable and circular specialty polymer solutions designed with bio-based, recycled, and/or mass balanced certified raw materials, while maintaining the same high performance characteristics. Kalix® 2545 and 2555 help OEMs meet today’s most pressing sustainability metrics while preparing for tomorrow’s regulations and design standards.
Let’s shape the next generation of smarter, lower-impact devices together.
