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CYCOM® 5320-1 is a toughened epoxy resin prepreg system designed for out-of-autoclave manufacturing of primary structural applications.

CYCOM® 5250-4 is a 350°F to 400°F (177°C to 204°C) curing bismaleimide resin with a service temperature range of -75°F to 400°F (-59°C to 204°C).

BR® 6747-1 is a one part, water-based, chromate-based, modified epoxy corrosion inhibiting primer.

BR® 127 corrosion inhibiting primer is a modified epoxy primer. It is the industry standard for high-performance corrosion inhibiting primers.

FM® 3500EZP is a peel ply optimized to provide consistent and reproducible surface for composite co-bonding or secondary bonding applications.

FM®309-1 is a next generation film adhesive for bonding composite and metallic structures.

FM® 300-2 film adhesive is a 250°F (121°C) cure version of Syensqo’s widely used FM® 300 film adhesive

FM® 209-1 is a next generation film adhesive specially formulated for out-of-autoclave bonding of both metallic and composite.

FM® 490B is a modified epoxy core splice foam that may be cured at temperatures ranging from 225°F to 350°F (107°C to 177°C) by either free foaming or r

A unique way to deliver ceramides to the skin

FM® 404NA Adhesive Foam intended for core-splicing, bonding inserts or edge member to core.

Empowering skin repair through a blend of Ceramides.

Pure biomimetic ceramide III for a stronger barrier function

CYASORB® CYXTRA® V9800 delivers advanced UV stabilization for translucent PP-based automotive exteriors, under demanding UV exposure.

CYASORB® CYXTRA® V9100 is developed specifically for translucent PP-based automotive interior applications where superior thermal stabilization is essential.

SolvaLite® 714 ReGen is a 150°C (302°F) rapid curing, epoxy prepreg resin system with renewable content, designed to enable high volume press cure manufacturing.

MTM® 58B ReGen is a 135°C (275°F) curing epoxy prepreg with renewable content developed for automotive structural and body panel applications.