AI is reshaping data centers
AI workloads are reshaping data center infrastructure by driving more servers into denser rack environments. Larger models, faster training cycles, and growing inference demand are increasing rack-level power requirements and concentrating more heat into smaller physical footprints. As a result, data center operators and technology providers are rethinking how infrastructure is cooled, powered, and designed for long-term reliability.
This shift is creating new performance requirements across the data center. Thermal systems must support more advanced cooling strategies, power architectures are moving toward higher-voltage and more power-dense designs, and IT hardware must continue to deliver speed, storage capacity, and reliability under more demanding operating conditions. These changes create a growing need for advanced fluids and specialty materials that can support both current-generation AI infrastructure and next-generation high-density architectures.
Our solutions for AI Data Centers Applications
Immersion Cooling for High-Density AI
As AI rack densities increase, advanced cooling approaches are becoming more important for managing thermal performance. Syensqo supports this transition with Galden® PFPE immersion cooling fluids, designed for high-density AI and HPC environments where fluid performance is critical. Galden® is especially relevant for next-generation immersion cooling applications, offering a robust solution for customers evaluating high-performance, reliable, and safe cooling fluids for demanding AI infrastructure.
High-Performance Materials for Chemically, Thermally & Electrically Demanding AI Infrastructure
AI data centers are creating harsher operating conditions for thermal and power components, including higher temperatures, greater mechanical stress, exposure to cooling fluids, corrosion-sensitive environments, and higher-voltage architectures. Syensqo’s high-performance materials help customers design components for reliability under these combined stresses, including cooling fan components, liquid cooling circulation systems, liquid-cooled busbars, and high-voltage busbars, busways, and connectors.
Material Platforms Enabling Data, Storage, and Connectivity System Growth
Beyond cooling and power management, AI infrastructure growth depends on reliable material platforms that support data transmission, storage, and high-speed connectivity. Syensqo’s broader portfolio enables applications such as wire and cable insulation, hard disk drive components, and PCB connectors including DDR and backplane connector designs. These mature material platforms help support the reliability, scalability, and performance required as AI infrastructure continues to expand.
Application Coverage
Syensqo’s application coverage spans the key systems being reshaped by AI data center growth: thermal management, power management, and IT hardware. The table below maps current-generation and next-generation AI infrastructure needs to the applications where Syensqo’s advanced fluids and material platforms can create value — from established components used in today’s data centers to emerging architectures designed for higher rack densities and more demanding operating conditions.
| Segment | Current AI Workloads | Next-Generation AI Workloads |
| Thermal Management | Cooling fan components; Direct liquid cooling circulation components | Fluids for immersion cooling |
| Power Management | Liquid-cooled power components like busbars | High-voltage busbars, busways, and connectors |
| Computer Hardware systems | Wire & Cable insulation; Precision components in Hard disk drives | PCB connectors, including DDR and backplane connector applications |
Products portfolio
Data centers are the backbone of today’s Artificial Intelligence revolution. Syensqo supports this transformation with advanced materials solutions engineered to perform under extreme electrical, thermal, chemical and mechanical conditions—helping enable safer, more efficient and more resilient data center systems.
