Data Centers Products

Syensqo helps solve critical AI data center challenges through three connected solution pillars: high-density cooling, harsh-environment materials, and scalable material platforms. Together, these solutions support the thermal, power, and IT hardware needs of current and next-generation AI infrastructure.

• Galden® PFPE is Syensqo’s lead fluid platform for high-density AI and HPC immersion cooling. Designed for demanding thermal management environments, Galden® supports both single-phase and two-phase immersion cooling applications, with particular strength in two-phase systems where phase-change heat removal, dielectric performance, fluid stability, compatibility, safety, and reliability are critical. For next-generation AI rack architectures with rising rack power and chip thermal design power, Galden® provides a commercially proven immersion cooling fluid solution that can help customers move from evaluation toward real-world deployment.
• Amodel® PPA supports demanding power management and connectivity applications in AI data center infrastructure. In rack busbars, white-space busways, and power connectors, Amodel® can help address high-temperature and high-voltage performance requirements, including insulation needs associated with next-generation power architectures such as 800 VDC distribution. In liquid-cooled busbar designs, it can support insulation and component performance where thermal resistance, electrical reliability, and coolant-exposed operation are important. Amodel® PPA is also relevant for high-speed connector applications, including PCB, DDR, backplane, and optical connector components where dimensional stability, thermal performance, design precision, and reliable signal transmission are key requirements.
• Ryton® PPS is a high-performance material platform for data center components exposed to elevated temperature, electrical demands, and mechanical stress. In power management applications, Ryton® can support rack busbars, busways, and power connectors where thermal resistance and electrical insulation performance are critical, including liquid-cooled busbar environments. Ryton® PPS is also relevant for cooling fan housings and motor-adjacent components that may face higher fan speeds, vibration, and increased heat as AI rack thermal loads rise.
• Solef® PVDF supports both fluid-handling and wire and cable applications in AI data center infrastructure. In liquid cooling circulation systems, Solef® can be used for components such as manifolds, pipes, quick disconnects, fittings, and pumps where fluid purity, corrosion resistance, reliable welding and joining, long-term stability, and lightweighting versus metal are important design considerations. In wire and cable insulation and jacketing, Solef® PVDF can support reliable power and data transmission where electrical reliability, flame/smoke/toxicity performance, and long-term durability are required.
• Radel® PPSU is positioned for liquid cooling circulation components in AI data center thermal management systems. Applications such as manifolds, pipes, quick disconnects, fittings, and pumps require materials that can withstand exposure to cooling fluids and corrosion-sensitive environments while supporting long-term reliability. Radel® PPSU can help customers design fluid-handling components where chemical compatibility, dimensional stability, reliable joining, durability, and lightweight alternatives to metal are important.
• KetaSpire® PEEK supports high-performance applications where precision, mechanical strength, dimensional stability, and long-term reliability are critical. In cooling fan components, KetaSpire® can support fan housings and motor-adjacent parts exposed to higher mechanical stress, vibration, and elevated temperatures. In IT hardware, KetaSpire® PEEK is relevant for hard disk drive components, including next-generation storage technologies such as HAMR, where precision, durability, and consistent performance in demanding operating environments are important.
• Halar® ECTFE supports wire and cable insulation and jacketing applications for AI data center infrastructure. As AI deployments scale, wire and cable systems must provide reliable power and data transmission while meeting demanding safety and durability requirements. Halar® ECTFE can support applications where electrical reliability, flame/smoke/toxicity performance, chemical resistance, and long-term protection are important design considerations.