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Dielectric Material Solutions for 5G Communication Technologies

With the launch of 5G communication, OEMs of electronic components face a number of challenges associated with transmitting high frequency signals with high-performance materials. Materials for 5G communication must exhibit exceptional dielectric properties or low dielectric constants to mitigate signal loss in a range of applications and components, including flexible printed circuits (FPC) and printed circuit boards (PCB), wire and cables, smart devices and base station antennas. Accordingly, OEMs turn to fluoropolymers and specialty thermoplastics, such as Syensqo’s  low loss dielectric polymers for today’s most advanced electronic components in the cutting-edge 5G communications field.  


Dielectric Fluoropolymers for Flexible Printed Circuit Boards and Wire and Cables

FPCs and PCBs in 5G communication present the challenges of high frequency communication and high-speed networks where radio frequency and signal can easily decay and be lost. As dielectric loss is one of the significant contributors to signal loss, materials for FPC and PCB components demonstrate a superior dielectric performance, which is preferred for inhibiting loss in high frequency communication applications. These specialty solutions must also deliver the traditionally expected performance, as well as meet or exceed demands regarding processing efficiency and reliability. Additionally, materials for wire and cable applications for 5G communications must provide low dielectric loss, and be capable of insulating the high-speed signals without interfering with the high frequency transmission.

Fully-fluorinated polymersare choice solutions for today’s FPCs and PCBs used in 5G technology. These FPC and PCB dielectric materials offer a tremendous combination of dielectric properties with chemical and high-temperature performance abilities. Additionally, these high-performance, dielectric fluoropolymers demonstrate are melt processable, which eases processability for OEMs of electronic components. 

Syensqo’s Solef® PVDF, a partially fluorinated, semi-crystalline polymer, is an excellent material choice for wire and cable applications in modern 5G platforms. Equipped with high-performance electrochemical stability, Solef® PVDF also exhibits exceptional permeation resistance, high purity and the best-in-class mechanical properties, optimal for piping material in 5G telecommunication cables and fiber optics. Its low dielectric properties allow the efficient transmittance of 5G signals, ensuring minimal loss in a range of high frequency applications. 


Dielectric Thermoplastics for 5G Antennas

Antennas for 5G communications and base stations require significantly greater capacity, high gain and a wider wireless spectrum than conventional antennas. The materials used for traditional antennas are often unable to meet the high frequency requirements of 5G, and cutting-edge base station antennas present both structural and performance challenges, as OEMs strive to source high-performance, highly productive solutions. Efficiently transmitting electricity becomes increasingly important, and components utilized for 5G antenna applications must have sufficient dielectric properties to meet these unique performance expectations. 

Syensqo’s  Xydar® LCP is a liquid crystal polymer specially designed to reduce dielectric loss. Due to its low moisture absorption and outstanding flow properties, this high-performance resin is the optimal material choice for 5G antenna substrates and housings. Additionally, Xydar® LCP offers durable strength and performance and extremely high temperatures, to deliver exceptional longevity and reliability in the most complex environments. 

Ryton® PPS, one of Syensqo’s  most advanced aromatic thermoplastics, also provides outstanding flow properties. Its combination of dielectric performance and dimensional stability make it an ideal metal replacement in an array of 5G telecommunication and high frequency applications. Ryton® PPS also demonstrates exceptional creep resistance to provide OEMs with a reliable, long-lasting solution for its end-use components.