Usages

Wafer Handling Equipment and Containers

The Front Opening Universal Pod (FOUP) and the Standard Mechanical Interface (SMIF) are two wafer handling tools that require exceptionally unique materials to meet stringent cleanliness and security requirements.

Front Opening Universal Pod (FOUP)

The Front Opening Universal Pod (FOUP) is typically used for 300 mm wafers in semiconductors and requires materials that offer resistance to chemicals and superior strength to keep the wafer safe. 

Standard Mechanical Interface (SMIF)

The Standard Mechanical Interface (SMIF) is appropriate for 200 mm wafers in semiconductors and functions similarly to the FOUP. Both SMIF and FOUP applications need to withstand high temperatures and remain excessively clean.