Key Materials for Advanced Wet Etching Applications
Our advanced solutions enhance many key wet etching components. Syensqo’s materials optimize components including the chemical delivery system, structural parts, o-rings and seals, UPW piping system and wafer containers.
Chemical Delivery System
Halar® ECTFE and Solef® PVDF improve the chemical delivery system used in wet etching.
Structural Parts
Halar® ECTFE offers chemically resistant and thermally stable properties to meet the need for the high purity conditions of wet processing equipment.
O-Rings and Seals
Tecnoflon® Fluoroelastomers (FKM) and Perfluorelastomers (FFKM) enhance O-rings and seals that are used in the semiconductor fabrication process and require a unique combination of properties to ensure optimal performance.
UPW Piping System
Solef® PVDF and KetaSpire® PEEK meet UPW’s special contamination specifications for high-purity conditions while simultaneously satisfying long-term mechanical and performance demands.
Wafer Containers
Wafer container manufacturers trust Syensqo to supply durable materials such as KetaSpire® PEEK which offer high-temperature service and virtually universal chemical resistance.
Explore all products for Semiconductors
