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Launch of Atlas V Juno from Cape Canaveral AFS
Space & Launch


Space and Launch Solutions Optimized for the Final Frontier

Syensqo’s space and launch materials have been making the journey out of Earth’s atmosphere for more than 50 years and will continue to play a part in mission-critical applications. From rocket motor case prepregs or durable specialty polymers that were on board during the Apollo 11 mission to state-of-the-art ablative materials used in NASA’s Artemis missions, Syensqo remains at the forefront of material innovation for space and launch applications. We helped put the first man on the Moon, and we are well-positioned to play a leading role in the ongoing commercial and defense missions in LEO, CisLunar colonization and future exploration on Mars.

High-Temperature Ablatives

  • MX 4926N is a rayon-based carbon fabric impregnated with a modified phenolic resin ideal for high-heat applications like rocket nozzle materials and motors, exit cones and overwraps.
  • MX 2600 is a silica fabric impregnated with phenolic resin containing silica filler. MX 2600 is available as a chopped molding compound for unique manufacturing needs and high-temperature ablative materials. 
  • FM 5504 is a high-purity silica-reinforced prepreg employing a MIL-R-9299 resin that is useful in intermediate-temperature ablative applications where oxidation potential is high. FM-5504 is suitable for short-term insulation service in the range of 3000-4000°F (1650-2200°C).

Structural Composites

  • CYCOM® 977-2 are 350°F (177°C) curing toughened epoxy resins with a 338°F (170°C) dry and 275°F (135°C) wet Glass Transition temperatures. CYCOM® 977-2 is formulated for autoclave or press molding.
  • CYCOM® 1908-6 is a 300⁰F - 350⁰F (149⁰C - 177⁰C) resin-impregnated carbon fiber tow-curing epoxy resin with a wet service temperature of 180⁰F - 200⁰F (82⁰C - 93⁰C) and a dry service temperature of 250⁰F - 350⁰F (121⁰C - 177⁰C). Typical applications for CYCOM® 1908/T800-12K include use in pressure vessels and rocket motor cases.
  • CYCOM® 950-1; this epoxy resin is a 250°F (121°C) curing system with the performance of a 350°F (177°C) curing epoxy and is formulated for autoclave or oven/vacuum bag processing for space flight applications.
  • MTM 46/45/44 flexible curing temperature, high performance, toughened epoxy matrix system optimized for low pressure, vacuum bag processing or autoclave cure of payload fairing materials and other space structures.
  • CYCOM® 5320-1 is a toughened epoxy resin prepreg system designed for out-of-autoclave manufacturing of primary structural applications. Because of its lower-temperature curing capability, it is also suitable for prototyping where low-cost tooling or vacuum-bag-only curing is required.
  • CYCOM® EP2190 This highly toughened resin is formulated with the most advanced epoxy chemistry. Optimized for structural efficiency with excellent resistance to impact and delamination growth under fatigue for launch vehicle primary structure.
  • CYCOM® 5250-4 The bismaleimide resin with a service temperature range of -75°F to 400°F (-59°C to 204°C) and improved damage-resistance ideal for modern spacecraft materials.
  • Avimid S [missing link]

Adhesive Bonding and Primers

  • BR® 127; this corrosion-inhibiting primer is a modified epoxy primer. It is the industry standard for high-performance corrosion inhibiting primers and has been used in virtually every aerospace program since its introduction.
  • FM® 300 - A strong adhesive designed to bond metal-to-metal and composite structures. When combined with other Syensqo aerospace materials, it is ideal for creating environmental resistance in space and satellite components and structures.
  • FM® 57 film adhesive is a condensation polyimide adhesive supplied as a supported film with a woven fiberglass carrier. FM 57 does not contain methylene dianiline (MDA). It is suitable for bonding metallic and non-metallic substrates as well as honeycomb structures.
  • FM®309-1 A next-generation film adhesive for bonding composite and metallic structures. This new film provides a unique combination of high Tg [360°F (182°C)], high toughness and higher temperature properties ideal for launch vehicle primary structure.
  • FusePly™ - As a breakthrough bonding technology with improved performance, optimized build rates and enhanced lightweighting in launch vehicle composite bonding applications, FusePlyTM is designed for reliable bonding that results in covalently bonded structures. 
  • HT® 424 is an aluminum-filled modified epoxy phenolic resin coated on a glass carrier. It was developed for bonding metal-to-metal and sandwich composite structures requiring long-term exposure to 300˚F (149˚C) and short-term exposure to 500˚F (260˚C) in thermal protection applications.
  • FM 410-1 A modified epoxy adhesive foam containing no metallic fillers designed for honeycomb splicing under ambient pressure and ideal for bonding large skins on fairing or primary rocket structures.

Thermoplastic Polymers

  • APC thermoplastic composite tapes deliver exceptional weight and cost advantages in addition to unique characteristics optimized for use in innovative space and launch applications. With options for a thermoplastic matrix based on PEKK or PEEK, manufacturers can select the ideal combination of features for specialized usage.
  • Torlon® PAI The polyamide-imide (PAI) is the highest performing, melt-processable thermoplastic. The amorphous polymer has exceptional resistance to wear, creep and chemicals and performs well under severe service conditions up to 500°F (260°C).